Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders

Parallel to the development of new lead-free solders, electronic packaging has gone through a considerable evolution. A redistribution layers allows increase functionality by increasing number inputs/outputsin packagewhile reducing size. The reliability package is strongly influenced interconnects. During production and service life, there are thermal processes involved that may lead fatigue. In this work, two-dimensional finite elementmodel Fan-Out Wafer Level Packaging (FO-WLP) was built, simulations test cycles were carried out varying solder interconnect material: SAC305, SACQ, SACR, orInnoLot. oscillating load from –40°C 125°C applied for three hours.State art concerning joint models based on creep behavior reveals benefit using energy-based parameters, as failure inversely proportional average strain energy density.Based theaverage density simulation results, withdifferent solderswas compared.The qualitative results suggestthat SACQ significant advantage in operational lifetime compared toSACR, InnoLot, SAC305.